Hal Leadfree + Gold Finger Double PCB Manufacturing

Product Details
Customization: Available
Structure: Double-Sided Rigid PCB
Dielectric: FR-4
Gold Member Since 2024

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Basic Info.

Model NO.
New Product-7
Application
Consumer Electronics
Flame Retardant Properties
V0
Surface
OSP,Immersion Gold,Hal Lead Free,Hal
Solder Mask
Green,Red,Yellow,White,Black,Blue,etc
Shipment
Air,Sea,Express(DHL TNT FedEx EMS UPS)
Sample Date
3-5days
Transport Package
Vacuum Packing
Specification
UL, TS16949, IPC 600 CLASS 2
Trademark
ZAPON
Origin
China
HS Code
85340090
Production Capacity
50000sqm/Month

Product Description

Material: FR-4
Layer Coverage: 4Layers
Thickness: 1.6mm
Surface Technique: HAL Leadfree + Gold Finger
Line Width/Space: 5mil/5mil
Solder Mask Color: Green
Special: BGA, Gold Finger
he products:
Single-side PCB: CEM-1, FR-2, FR-1 XPC-94HB
Double-side PCB: FR-4, CEM-3, High Tg, Aluminum, Halogen Free
Multi-layer PCB: 4 to 22 layers(FR-4, High Tg, Rogers)
Certification: UL, ISO9001, ISO/TS16949: 2002, IS014001 and RoHS
THE CAPACITY OF PRODUCTION: 50, 000SQM. /month
 Capabilities
Number of LayersFrom 4-layer to 22- Layer
MaterialFR-4,HighTg, Rogers
Halogen Free
PCB ThicknessMin.thickness0.4mm(16mil)
 Max.thickness3.2mm(128mil)

Surface finished
Gold Plating
 Immersion Gold(Silver)
 HAL Lead Free
 Hot Air Solder Leveling(HASL)
 Entek Coating (OSP)
Solder MaskGreen,White,Black,Yellow,Red,Blue
Other printingGold Finger
 Carbon Print, Peelable Mask
 Solder Mask Plugged Hole
Copper thickness1/ 2 oz (18 μm) - 4 oz (140 μm)
Min. Finished Hole Size0.2mm(8mil)
Hole Size Tolerance (PTH)+/ -0.076mm (3 mil)
Hole Size Tolerance (NPTH)+/-0.05mm (2 mil)
Min. Line Width and Spacing0.1mm (4 mil)
Min. Solder Mask Clearance0.05mm (2 mil)
Min. Annular Ring0.076mm (3mil)
Profile and V-CutCNC-Routing, Stamping and Beveling,V-CUT,CNC
 
Special ProcessMicro-section, Chamfer for Gold Finger
   File format  Gerber file , CAM350 ,Protel,PowerPCB
   E-TESTFlying Prob , E-test ,Fixture
  Other Test  Impedance , Slice up
  Warp & Twist ≤0.7%

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