2 Layer OSP Finishing PCB

• Type: Rigid Circuit Board
• Dielectric: FR-4
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Transport Package: Vacuum Packing
• Specification: UL, TS16949, IPC 600 CLASS 2
• Model NO.: New Product-
• Trademark: ZAPON
• Origin: China
• HS Code: 85340090
• Production Capacity: 50, 000SQM. /month

Product Description

The products:

Single-side PCB: CEM-1, FR-2, FR-1 XPC-94HB

Double-side PCB: FR-4, CEM-3, High Tg, Aluminum, Halogen Free

Multi-layer PCB: 4 to 22 layers(FR-4, High Tg, Rogers)

Certification: UL, ISO9001, ISO/TS16949: 2002, IS014001 and RoHS

THE CAPACITY OF PRODUCTION: 50, 000SQM. /month

		Capabilities
Number of Layers		From 4-layer to 22- Layer
Material		FR-4,HighTg, Rogers Halogen Free
PCB Thickness	Min.thickness	0.4mm(16mil)
	Max.thickness	3.2mm(128mil)
Surface finished		Gold Plating
		Immersion Gold(Silver)
		HAL Lead Free
		Hot Air Solder Leveling(HASL)
		Entek Coating (OSP)
Solder Mask		Green,White,Black,Yellow,Red,Blue
Other printing		Gold Finger
		Carbon Print, Peelable Mask
		Solder Mask Plugged Hole
Copper thickness		1/ 2 oz (18 μm) - 4 oz (140 μm)
Min. Finished Hole Size		0.2mm(8mil)
Hole Size Tolerance (PTH)		+/ -0.076mm (3 mil)
Hole Size Tolerance (NPTH)		+/-0.05mm (2 mil)
Min. Line Width and Spacing		0.1mm (4 mil)
Min. Solder Mask Clearance		0.05mm (2 mil)
Min. Annular Ring		0.076mm (3mil)
Profile and V-Cut		CNC-Routing, Stamping and Beveling,V-CUT,CNC
Special Process		Micro-section, Chamfer for Gold Finger
File format		Gerber file , CAM350 ,Protel,PowerPCB
E-TEST		Flying Prob , E-test ,Fixture
Other Test		Impedance , Slice up
Warp & Twist		≤0.7%