2018 High Quality Three Dimensional MCPCB for LED Lighting

Product Details
Customization: Available
Structure: Single-Sided Rigid PCB
Material: Aluminium
Gold Member Since 2024

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Basic Info.

Model NO.
New Product-11
Flame Retardant Properties
V0
Processing Technology
Electrolytic Foil
Production Process
Subtractive Process
Insulation Materials
Organic Resin
Surface Technique
Hal, HASL, OSP
Board Thickness
0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm, 2.2mm
Thermal Conductivity
1.0W/M.K, 1.5W/M.K, 2.0W/M.K, 3.0W/M.K, 4.0W/M.K
Sample Date
3-5days
Transport Package
Vacuum Packing
Specification
SGS UL ISO
Trademark
DJ
Origin
China
HS Code
85340090
Production Capacity
3000.00sqms/Month

Product Description

Material: Aluminium
Layer Coverage: 1Layer
Thickness: 1.6mm
Surface Technique: HAL, HASL, OSP
Line Width/Space: 0.2mm
Thermal Conductivity: 1.0W/mk, 2.0W/mk, 3.0W/m. K
Copper: 1oz. 2oz. 3oz
Solder Mask Color: White, black.

Features:

1.3D foldable aluminum base LED board make the light 360 angles illuminate!

2. Mainly used in automobile fields, foldable LED light can meet car lamp all requirements, which can be folded to any shape to make the head lamp more beautiful, meanwhile aluminum base LED light has very good heat dissipation function, which make the lamp life more longer.

3.3D LED light make the energy fully used, it is energy saving and environmentally friendly.
  Test item Technology request Unit Test result
1 Peel Strength A ≥ 1.0 N/mm 1.05
After thermal stress (260 ordm;C ) ≥ 1.0 N/mm 1.05
2 Blister test AfterThermal stress (288 ordm;C, 2min) 288ordm;C  2 min
No delaminating
/ OK
3 Themal Resistance ≤ 2.0 ordm;C /W 0.65
4 Flammability(A) FV-O / FV-O
5 Surface Resistivity A ≥ 1 × 10 5 M Ω 5.0 × 10 7
Constant humidity treatment
(90%,3 5 ordm;C ,96h)
≥ 1 × 10 5 M Ω 4.5 × 10 6
6
7
Volume Resistivity A ≥ 1 × 10 6 M Ω@ m 1.0 × 10 8
Constant humidity treatment
(90%,3 5 ordm;C ,96h)
≥ 1 × 10 6 M Ω@ m 1.9 × 10 7
8 Dielectric Breakdown (DC ) ≥ 25 Kv/mm 31
9 Dielectric constant (1MHz)
(40 ordm;C, 93% , 96h)
≤ 4.4 / 4.2
10 Dielectric dissipation factor (1MHz )
(40ordm;C ,93%,96h)
≤ 0.03 / 0.029
  Accelerated aging experiment
(125 ordm;C ,2000h)
  The laminate bace should no wrinkles,no crack,no delaminating or no pine / OK
11 High low temperature impact test
(-50 ordm;C, 15min, 80ordm;C , 15minTOTAL   DO 15 ~ 20 Circulation) 
Peel Strength / N/mm 1.39 ~ 1.64
Surface Resistivity / M Ω 1.9 × 10 8 ~6.4 × 10 8
 
 

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