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Zhejiang Zapon Electronic Technology Co., Ltd.

MCPCB, Aluminum Based PCB, Metal Core PCB manufacturer / supplier in China, offering 3.0W/M. K 1.6mm Mtta Aluminium PCB Manufacturing From China Mainland, 1.0mm Multilayer Green Soldermask Ink PCB From Zapon, Single Side Traffic Control System Board PCB (PCB-68) and so on.

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Supplier Homepage Product Aluminum PCB 3.0W/M. K 1.6mm Mtta Aluminium PCB Manufacturing From China Mainland

3.0W/M. K 1.6mm Mtta Aluminium PCB Manufacturing From China Mainland

FOB Price: US $65-90 / Square Meter
Min. Order: 5 Square Meters
Min. Order FOB Price
5 Square Meters US $65-90/ Square Meter
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Port: Shanghai, China
Production Capacity: 5000sqm/Month
Payment Terms: L/C, T/T

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Basic Info
  • Model NO.: Aluminium PCB-9
  • Flame Retardant Properties: V0
  • Base Material: Aluminum
  • Mechanical Rigid: Rigid
  • Board Thickness: 0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.2mm
  • Ccl Brand: Jh,Ccaf.etc
  • Trademark: ZAPO
  • Specification: SGS UL ISO
  • HS Code: 85340090
  • Type: Rigid Circuit Board
  • Dielectric: Aluminium
  • Insulation Materials: Organic Resin
  • Material: Aluminum
  • Thermal Conductivity: 1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K
  • Sample Date: 3-5days
  • Transport Package: Vacuum Packing
  • Origin: China
Product Description
Aluminum base copper-clad laminate have excellent flame retardant, high mechanical strength, dimensional stability etc. Especially it has very good heat sink, electromagnetic shielding and solder float.

It's widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, sound box, power supply module and acoustics shielding system etc.

Note: We specially produces Metal Base Copper-Clad Laminates, and our products have been compiled series with all complete specifications.
The tapy and specification of Aluminum based Laminates CCAF-01, CCAF-04-A, CCAF-05etc. And 0.8mm, 1.0mm, 1.5mm, 2.0mm, etc.
Thickness of the copper: 18um, 35um, 70um, 105um.
Base size: 500mm × , 600mm (20"× , 24"); 600mm × , 1060mm (24"× , 42")

CCAF-01 Aluminum-base copper-clad laminate
The test base: CCAF-01 the high heat dissipation Aluminum-base copper-clad laminate
Thickness of the copper: 35um
Thickness of the diclectric: 70um
Thickness of the aluminum-base: 1.5mm

The result of the test:
ItemTest itemTechnology requestUnitTest result
1Peel StrengthA≥ 1.8N/mm2
After thermal stress (260ordm; C)≥ 1.8N/mm1.8
2Blister test AfterThermal stress (260& ordm; C, 2min )No delaminating/Ok
4Thermal resistance≤ 2.0ordm; C  /W1
5Surface ResistivityA≥ 1 × 10 5M Ω5 × 10 7
Constant humidity treatment≥ 1 × 10 5M Ω2 × 10 6
(90%, 3 5 ordm; C, 96h)
6Volume ResistivityA≥ 1 × 10 6M Ω @ m4 × 10 8
Constant humidity treatment≥ 1 × 10 6M Ω @ m5 × 10 7
(90%, 3 5ordm; C, 96h)
7Dielectric Breakdown ( DC )≥ 28.5Kv/mm31
8Dielectric constant (1MHz )≤ 4.4/4.2
(40 ordm; C, 93%  , 96h )
9Dielectric dissipation factor (1MHz )≤ 0.03/0.02
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Ms. Jenny Jia
Foreign Trade Executive
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