| Customization: | Available |
|---|---|
| Structure: | Multilayer Rigid PCB |
| Dielectric: | FR-4 |
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| NO. | ITEM | PARAMETER |
| 1 | Surface Finish | HAL,HAL leadfree,Gold Plating,OSP,Immersion gold,Immersion Silver,Immersion Sn and Gold Finger |
| Surface Plating | Peelable Mask and Carbon | |
| 2 | Layers | From one side to 16Layers |
| 3 | Base Material | FR-4(High Tg,Halogen Free),CEM-1, CEM-3,Rogers |
| 4 | Finished Copper Weight | 17um-140um |
| 5 | Min Line Width/Space | 0.1mm/0.1mm ( 4mil / 4mil ) |
| 6 | Min Finished Hole Size | 0.2mm(8mil) |
| 7 | NPTH Hole Dia.Tolerance | ±0.05mm(2mil) |
| 8 | PTH Hole Dia.Tolerance | ±0.075mm(3mil) |
| 9 | Hole Plating Thickness | ≥20um |
| 10 | Max Panel Size | 500mm X 1200mm |
| 11 | Outline Tolerance | ±0.127mm(5mil) |
| 12 | Thickness | 0.2~3.2MM |
| 13 | Thickness Tolerance (≥0.8mm) |
±8% |
| 14 | Thickness of Min. Mask | 10um |
| 15 | Solder Mask | Green,Yellow,Black,Blue,Red, Peelable mask |
| 16 | Min. String Width | 8 mil |
| 17 | Max. String Width | 32 mil |
| 18 | Silkscreen Color | Green,Yellow,Black,Blue,Red |
| 19 | File format | Gerber file,CAM350,Protel,PowerPCB |
| 20 | E-TEST | Flying Prob,E-test, Fixture |
| 21 | Other Test | Impedance, Slice up |
| 22 | Warp & Twist | ≤0.7% |
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