| Customization: | Available |
|---|---|
| Type: | Rigid Circuit Board |
| Dielectric: | FR-4 |
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| Item |
Capabilities |
|
| Number of Layers |
Double Side |
|
| Material |
FR-4,CEM-3,HighTg, Aluminum, Halogen Free |
|
| PCB Thickness |
Min.thickness |
0.2mm(8mil) |
| Max.thickness |
3.2mm(128mil) |
|
Surface finished |
Gold Plating |
|
| Immersion Gold(Silver) |
||
| HAL Lead Free |
||
| Hot Air Solder Leveling(HASL) |
||
| Entek Coating (OSP) |
||
| Solder Mask |
Green,White,Black,Yellow,Red,Blue |
|
| Other printing |
Gold Finger |
|
| Carbon Print, Peelable Mask |
||
| Solder Mask Plugged Hole |
||
| Copper thickness |
1/ 2 oz (18 μm) - 4 oz (140 μm) |
|
| Min. Finished Hole Size |
0.3mm(12mil) |
|
| Hole Size Tolerance (PTH) |
+/ -0.076mm (3 mil) |
|
| Hole Size Tolerance (NPTH) |
+/-0.05mm (2 mil) |
|
| Min. Line Width and Spacing |
0.10mm (4 mil) |
|
| Min. Solder Mask Clearance |
0.076mm (3 mil) |
|
| Min. Annular Ring |
0.1mm (4mil) |
|
| Profile and V-Cut |
CNC-Routing, Stamping and Beveling,V-CUT,CNC |
|
| Special Process |
Micro-section, Chamfer for Gold Finger |
|