2oz Aluminium OSP Circuit Board for LED PCB

• Customization: Available
• Type: Rigid Circuit Board
• Flame Retardant Properties: V0
• Model NO.: Aluminium PCB-7
• Dielectric: Aluminium
• Base Material: Aluminum
• Insulation Materials: Organic Resin
• Mechanical Rigid: Rigid
• Material: Aluminum
• Board Thickness: 0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.2mm
• Thermal Conductivity: 1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K
• Ccl Brand: Jh,Ccaf.etc
• Sample Date: 3-5days
• Transport Package: Vacuum Packing
• Specification: SGS UL ISO
• Trademark: ZAPON
• Origin: China
• HS Code: 85340090
• Production Capacity: 5000sqms/Month

Product Description

Product Description:
Aluminum base copper-clad laminate have excellent flame retardant, high mechanical strength, dimensional stability etc. Especially it has very good heat sink, electromagnetic shielding and solder float. 
It's widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, sound box, power supply module and acoustics shielding system etc. 
Note: We specially produces Metal Base Copper-Clad Laminates, and our products have been compiled series with all complete specifications. 
The tapy and specification of Aluminum based Laminates CCAF-01, CCAF-04-A, CCAF-05etc. And 0.8mm, 1.0mm, 1.5mm, 2.0mm, etc. 
Thickness of the copper: 18um, 35um, 70um, 105um. 
Base size: 500mm ×, 600mm (20"×, 24"); 600mm ×, 1060mm (24"×, 42") 
CCAF-01 Aluminum-base copper-clad laminate 
The test base: CCAF-01 the high heat dissipation Aluminum-base copper-clad laminate 
Thickness of the copper: 35um 
Thickness of the diclectric: 70um 
Thickness of the aluminum-base: 1.5mm 
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Thickness of the aluminum-base: 1.5mm 
The result of the test:

	Test item				Technology request	Unit	Test result
1	Peel Strength		A		≥ 1.0	N/mm	1.05
			After thermal stress (260 ordm;C )		≥ 1.0	N/mm	1.05
2	Blister test AfterThermal stress (288 ordm;C, 2min)				288ordm;C  2 min No delaminating	/	OK
3	Themal Resistance				≤ 2.0	ordm;C /W	0.65
4	Flammability(A)				FV-O	/	FV-O
5	Surface Resistivity	A			≥ 1 × 10 5	M Ω	5.0 × 10 7
		Constant humidity treatment (90%,3 5 ordm;C ,96h)			≥ 1 × 10 5	M Ω	4.5 × 10 6
6 7	Volume Resistivity	A			≥ 1 × 10 6	M Ω@ m	1.0 × 10 8
		Constant humidity treatment (90%,3 5 ordm;C ,96h)			≥ 1 × 10 6	M Ω@ m	1.9 × 10 7
8	Dielectric Breakdown (DC )				≥ 25	Kv/mm	31
9	Dielectric constant (1MHz) (40 ordm;C, 93% , 96h)				≤ 4.4	/	4.2
10	Dielectric dissipation factor (1MHz ) (40ordm;C ,93%,96h)				≤ 0.03	/	0.029
	Accelerated aging experiment (125 ordm;C ,2000h)				The laminate bace should no wrinkles,no crack,no delaminating or no pine	/	OK
11	High low temperature impact test (-50 ordm;C, 15min, 80ordm;C , 15minTOTAL   DO 15 ~ 20 Circulation)			Peel Strength	/	N/mm	1.39 ~ 1.64
				Surface Resistivity	/	M Ω	1.9 × 10 8 ~6.4 × 10 8