2L Tg140 1.6mm, 35um Copper Immersion Gold Fr4 PCB

• Structure: Double-Sided Rigid PCB
• Dielectric: FR-4
• Material: Epoxide Woven Glass Fabric Laminate
• Application: Communication
• Flame Retardant Properties: V0
• Processing Technology: Electrolytic Foil
• Model NO.: Zapon PCB-01 Double- side FR4 PCB
• Production Process: Additive Process
• Base Material: Fr-4
• Brand: Zapon
• Transport Package: by Sea/Air
• Specification: /
• Trademark: Zapon
• Origin: China
• HS Code: 85340090
• Production Capacity: 80000 Sq. M/Month

Product Description

NO.	ITEM	PARAMETER
1	Surface Finish	HAL,HAL leadfree,Gold Plating,OSP,Immersion gold,Immersion Silver,Immersion Sn and Gold Finger
	Surface Plating	Peelable Mask  and  Carbon
2	Layers	From one side to 16Layers
3	Base Material	FR-4(High Tg,Halogen Free),CEM-1,        CEM-3,Rogers
4	Finished Copper Weight	17um-140um
5	Min Line Width/Space	0.1mm/0.1mm ( 4mil / 4mil )
6	Min Finished Hole Size	0.2mm(8mil)
7	NPTH Hole Dia.Tolerance	±0.05mm(2mil)
8	PTH Hole Dia.Tolerance	±0.075mm(3mil)
9	Hole Plating Thickness	≥20um
10	Max Panel Size	500mm X 1200mm
11	Outline Tolerance	±0.127mm(5mil)
12	Thickness	0.2~3.2MM
13	Thickness Tolerance (≥0.8mm)	±8%
14	Thickness of Min. Mask	10um
15	Solder Mask	Green,Yellow,Black,Blue,Red, Peelable mask
16	Min. String Width	8 mil
17	Max. String Width	32 mil
18	Silkscreen Color	Green,Yellow,Black,Blue,Red
19	File format	Gerber file,CAM350,Protel,PowerPCB
20	E-TEST	Flying Prob,E-test,  Fixture
21	Other Test	Impedance,  Slice up
22	Warp & Twist	≤0.7%