PCB Assembly for USB From Zapon Manufacturing

Product Details
Customization: Available
Metal Coating: Gold
Mode of Production: SMT
Gold Member Since 2024

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Basic Info.

Model NO.
PCBA-04
Layers
Multilayer
Certification
RoHS, CCC, ISO
Customized
Customized
Condition
Used
Transport Package
Vacuum Packing
Specification
UL, TS16949, IPC 600 CLASS 2
Trademark
ZAPON
Origin
China
HS Code
85340090
Production Capacity
50000sqm/Month

Product Description

The following information is requested for this service:
Gerber files of the bare PCB
Bill of materials to include: Manufacturer's part number, type of part, type of packaging, component locations listed by reference designators and quantity
Dimensional specifications for non-standard components
Assembly drawing, including any change notices
Final test procedures (if available)
In order to shorten the lead time, please advise us acceptable components for substitution (same specifications but different brand name) estimated order quantity
If possible, please send prototype/sample board to us for further reference (use FedEx/DHL to expedite the process)
ItemCapabilities
Number of LayersDouble Side
MaterialFR-4,CEM-3,HighTg, Aluminum,
Halogen Free
PCB ThicknessMin.thickness0.2mm(8mil)
 Max.thickness3.2mm(128mil)

Surface finished
Gold Plating
 Immersion Gold(Silver)
 HAL Lead Free
 Hot Air Solder Leveling(HASL)
 Entek Coating (OSP)
Solder MaskGreen,White,Black,Yellow,Red,Blue
Other printingGold Finger
 Carbon Print, Peelable Mask
 Solder Mask Plugged Hole
Copper thickness1/ 2 oz (18 um) - 4 oz (140 um)
Min. Finished Hole Size0.3mm(12mil)
Hole Size Tolerance (PTH)+/ -0.076mm (3 mil)
Hole Size Tolerance (NPTH)+/-0.05mm (2 mil)
Min. Line Width and Spacing0.10mm (4 mil)
Min. Solder Mask Clearance0.076mm (3 mil)
Min. Annular Ring0.1mm (4mil)
Profile and V-CutCNC-Routing, Stamping and Beveling,V-CUT,CNC
 
Special ProcessMicro-section, Chamfer for Gold Finger

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