| Customization: | Available |
|---|---|
| Type: | Combining Rigid Circuit Board |
| Flame Retardant Properties: | V0 |
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| No. | Item | Capabilities |
| 1 | Layers | 1-2 Layers |
| 2 | Finished Thickness | 16-134Mil (0.4MM-3.4MM ) |
| 3 | Max. Dimension | 500MM *1230MM |
| 4 | Material | DJ-A11(from 1W to 12W),TCB-2AL,HA80, VT-4B3,NRK,3D Bending,Copper base |
| 5 | Finished Thickness Tolerance | ≤1.0MM ±0.10MM -1.6MM ±0.15MM |
| 6 | Min.Line Width&Spacing | 4Mil (0.1MM ) |
| 7 | Copper Thickness | 35um, 70um,1 to 12oZ |
| 8 | Min. Finished Hole Size | 0.95MM |
| 9 | Min. Drill Size | 1.00MM |
| 10 | Max. Drill Size | 6.5MM |
| 11 | Finished Hole Size Tolerance | ±0.050MM |
| 12 | Aperture Position Precision | ±0.076MM |
| 13 | Warp & Twist | 0.75% |
| 14 | Min SMT PAD Size | 0.4MM±0.1MM |
| 15 | Min.Solder Mask PAD | 0.05MM(2Mil) |
| 16 | Min.Solder Mask Cover | 0.05MM(2Mil) |
| 17 | Solder mask Thickness | >12um |
| 18 | Min.Solder Mask Bridge | 0.1MM(4Mil) |
| 19 | Surface Finishing | HAL, HALLeadfree,OSP, Immersion Gold, etc |
| 20 | HAL Thickness | 5-30um |
| 21 | Immersion Gold Thickness | 1-3 Microinch |
| 22 | OSP Film Thickness | ENTEK PLUS HT:0.3-0.5um; F2:0.15-0.3um |
| 23 | V-CUT Angle | 30°,45°,60° |
| 24 | V-CUT Thickness | 0.4-3.4MM |
| 25 | V-CUT Precision | ±0.05MM, Up&Down Cut Deviation ±0.05MM,Residual Thickness ±0.05MM |
| 26 | Outline Finishing | Routing & Punching; Precision Deviation ±0.10MM |
| 27 | E-test Voltage | 250 ± 5V |
| 28 | E-test Resistance | 10Ω-100MΩ |
| 29 | Peel Strength | 288°, 30s ≥1.4 |
| 30 | Thermal Conductivity | 1.0 to 12W/m.k |
| 31 | Withstand Voltage | AC:1KV to 6.5KV, DC:1KV to 8.5KV |
| 32 | Thermal Stress | 288°,30s Non-Layered No Foaming |
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