| Type: | Rigid Circuit Board |
|---|---|
| Dielectric: | Aluminium |
| Material: | Fiberglass Epoxy |
| Flame Retardant Properties: | V0 |
| Mechanical Rigid: | Rigid |
| Processing Technology: | Electrolytic Foil |
| Customization: |
|---|
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Audited Supplier | Item | Test item | Technology request | Unit | Test result | ||
| 1 | Peel Strength | A | ≥ 1.8 | N/mm | 2 | |
| After thermal stress (260ordm;C) | ≥ 1.8 | N/mm | 1.8 | |||
| 2 | Blister test AfterThermal stress (260ºC, 2min ) | No delaminating | / | Ok | ||
| 3 | Flammability(A) | FV-O | / | FV-O | ||
| 4 | Thermal resistance | ≤ 2.0 | ordm;C /W | 1 | ||
| 5 | Surface Resistivity | A | ≥ 1 × 10 5 | M Ω | 5 × 10 7 | |
| Constant humidity treatment | ≥ 1 × 10 5 | M Ω | 2 × 10 6 | |||
| (90%,3 5 ordm;C,96h) | ||||||
| 6 | Volume Resistivity | A | ≥ 1 × 10 6 | M Ω· m | 4 × 10 8 | |
| Constant humidity treatment | ≥ 1 × 10 6 | M Ω· m | 5 × 10 7 | |||
| (90%,3 5ordm;C ,96h) | ||||||
| 7 | Dielectric Breakdown ( DC ) | ≥ 28.5 | Kv/mm | 31 | ||
| 8 | Dielectric constant (1MHz ) | ≤ 4.4 | / | 4.2 | ||
| (40 ordm;C,93% , 96h ) | ||||||
| 9 | Dielectric dissipation factor (1MHz ) | ≤ 0.03 | / | 0.02 | ||
| (40 ordm;C, 93% ,96h ) | ||||||
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