Aluminum PCB for LED with Taiyo Solder Mask

• Type: Rigid Circuit Board
• Flame Retardant Properties: V0
• Dielectric: FR-4
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Processing Technology: Electrolytic Foil
• Model NO.: MC PCB
• Application: LED Production
• Mechanical Rigid: Rigid
• Material: Aluminum
• Brand: DJ
• Transport Package: Vacuum Packing
• Specification: UL, TS16949, IPC 600 CLASS 2
• Trademark: ZAPON
• Origin: China
• HS Code: 85340090
• Production Capacity: 50000sqm/Month

Product Description

Our company has passed ISO9001:2008 Quality System Certification, UL and TS16949 Certification, ISO14001 Environment Certification while our products meet RoHS Directive. We operate under ISO9001:2008 Quality System Certification strictly integrating fine management into every production step to ensure our product quality ahead of others in this field.
Our company manufacture massively by mature technology products as follows: streetlight aluminum PCB, fluorescent lamp aluminum PCB, wash wall light aluminum PCB, spotlight aluminum PCB, bulb light aluminum PCB, tunnel lamp aluminum PCB and other aluminum PCBs. So far our business has reached over ten provinces and cities in China; abroad we have clients from America, England, Germany, Turkey, Malaysia, Russia, Japan, Brazil and many other countries.
In June 2012, our company took the first place to bring out 3D bending aluminum PCB widely used in LED lighting, car lamp, backlight and such areas bringing new revolution. The main consumers of 3D bending aluminum PCB were CREE, GE, Volkswagen, Audi, BOE, Topstar, ETi and  such famous enterprises at home and abroad.
Nowadays materials used by our company are from Microtek, Juding, Quanbao, Dupon, Beggs and such high-end materials able to manufacture products with coefficient of heat conductivity from 1.0W to 4.0W and to satisfy clients' needs both at home and abroad.

	Test item				Technology request	Unit	Test result
1	Peel Strength		A		≥ 1.0	N/mm	1.05
			After thermal stress (260 ordm;C )		≥ 1.0	N/mm	1.05
2	Blister test AfterThermal stress (288 ordm;C, 2min)				288ordm;C  2 min No delaminating	/	OK
3	Themal Resistance				≤ 2.0	ordm;C /W	0.65
4	Flammability(A)				FV-O	/	FV-O
5	Surface Resistivity	A			≥ 1 × 10 5	M Ω	5.0 × 10 7
		Constant humidity treatment (90%,3 5 ordm;C ,96h)			≥ 1 × 10 5	M Ω	4.5 × 10 6
6 7	Volume Resistivity	A			≥ 1 × 10 6	M Ω@ m	1.0 × 10 8
		Constant humidity treatment (90%,3 5 ordm;C ,96h)			≥ 1 × 10 6	M Ω@ m	1.9 × 10 7
8	Dielectric Breakdown (DC )				≥ 25	Kv/mm	31
9	Dielectric constant (1MHz) (40 ordm;C, 93% , 96h)				≤ 4.4	/	4.2
10	Dielectric dissipation factor (1MHz ) (40ordm;C ,93%,96h)				≤ 0.03	/	0.029
	Accelerated aging experiment (125 ordm;C ,2000h)				The laminate bace should no wrinkles,no crack,no delaminating or no pine	/	OK
11	High low temperature impact test (-50 ordm;C, 15min, 80ordm;C , 15minTOTAL   DO 15 ~ 20 Circulation)			Peel Strength	/	N/mm	1.39 ~ 1.64
				Surface Resistivity	/	M Ω	1.9 × 10 8 ~6.4 × 10 8