Countersink Hole Aluminum 2.0W/M. K PCB Manufacturing

Structure: Metal Base Rigid PCB
Material: Aluminium
Flame Retardant Properties: V0
Processing Technology: Electrolytic Foil
Production Process: Subtractive Process
Base Material: Aluminum
Customization:

Contact Supplier

Ms. Jenny Jia
Foreign Trade Executive
Gold Member Since 2024

Suppliers with verified business licenses

Manufacturer/Factory & Trading Company

Basic Info.

Model NO.
Aluminum PCB-12
Insulation Materials
Organic Resin
Board Thickness
0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.2mm
Thermal Conductivity
1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K
Ccl Brand
Jh,Ccaf.etc
Sample Date
3-5days
Transport Package
Vacuum Packing
Specification
UL ISO TS16949 IPC
Trademark
ZAPON
Origin
China
HS Code
85340090
Production Capacity
5000sqm/Month

Product Description

Aluminum base copper-clad laminate have excellent flame retardant, high mechanical strength, dimensional stability etc. Especially it has very good heat sink, electromagnetic shielding and solder float.

It's widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, sound box, power supply module and acoustics shielding system etc.

Note: We specially produces Metal Base Copper-Clad Laminates, and our products have been compiled series with all complete specifications.
The tapy and specification of Aluminum based Laminates CCAF-01, CCAF-04-A, CCAF-05etc. And 0.8mm, 1.0mm, 1.5mm, 2.0mm, etc.
Thickness of the copper: 18um, 35um, 70um, 105um.
Base size: 500mm × , 600mm (20"× , 24"); 600mm × , 1060mm (24"× , 42")

CCAF-04-A Aluminum-base copper-clad laminate
The test base: CCAF-04 the high heat dissipation Aluminum-base copper-clad laminate
Thickness of the copper: 35um
Thickness of the diclectric: 80um(matrial of the high heat dissipation)
Thickness of the aluminum-base: 1.5mm

The result of the test:
Item
 
Test item
 
Technology request
 
Unit
 
Test result
 
1
 
Peel Strength
 
A
 
≥ 1.0
 
N/mm
 
1.05
 
After thermal stress (260 ordm;C )
 
≥ 1.0
 
N/mm
 
1.05
 
2
 
Blister test AfterThermal stress (288 ordm;C, 2min)
 
288ordm;C  2 min
No delaminating
 
/
 
OK
 
3
 
Themal Resistance
 
≤ 2.0
 
ordm;C /W
 
0.65
 
4
 
Flammability(A)
 
FV-O
 
/
 
FV-O
 
5
 
Surface Resistivity
 
A
 
≥ 1 × 10 5
 
M Ω
 
5.0 × 10 7
 
Constant humidity treatment
(90%,3 5 ordm;C ,96h)
 
≥ 1 × 10 5
 
M Ω
 
4.5 × 10 6
 
6
7
 
Volume Resistivity
 
A
 
≥ 1 × 10 6
 
M Ω@ m
 
1.0 × 10 8
 
Constant humidity treatment
(90%,3 5 ordm;C ,96h)
 
≥ 1 × 10 6
 
M Ω@ m
 
1.9 × 10 7
 
8
 
Dielectric Breakdown (DC )
 
≥ 25
 
Kv/mm
 
31
 
9
 
Dielectric constant (1MHz)
(40 ordm;C, 93% , 96h)
 
≤ 4.4
 
/
 
4.2
 
10
 
Dielectric dissipation factor (1MHz )
(40ordm;C ,93%,96h)
 
≤ 0.03
 
/
 
0.029
 

 
Accelerated aging experiment
(125 ordm;C ,2000h)
 

 
The laminate bace should no wrinkles,no crack,no delaminating or no pine
 
/
 
OK
 
11
 
High low temperature impact test
(-50 ordm;C, 15min, 80ordm;C , 15minTOTAL   DO 15 ~ 20 Circulation) 
Peel Strength
 
/
 
N/mm
 
1.39 ~ 1.64
 
Surface Resistivity
 
/
 
M Ω
 
1.9 × 10 8 ~6.4 × 10 8
 

Send your message to this supplier

*From:
*To:
avatar Ms. Jenny Jia
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now

You Might Also Like

Contact Supplier

Ms. Jenny Jia
Foreign Trade Executive
Gold Member Since 2024

Suppliers with verified business licenses

Manufacturer/Factory & Trading Company
Number of Employees
70
Year of Establishment
2018-02-06