Gold Member Since 2008
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Zhejiang Zapon Electronic Technology Co., Ltd.

Aluminium Based PCB, LED PCB, PCB for LED Light manufacturer / supplier in China, offering 2016 High Quality Three Dimensional MCPCB for LED Lighting, Aluminium LED Light Bar SMD2835/5050, Epistar SMD LED Bar Light, LED Rigid Strip, Aluminum Based Circuit Board 2835 LED SMD 5630 Round LED Aluminum Rigid PCB and so on.

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Supplier Homepage Product NEW PRODUCT 2016 High Quality Three Dimensional MCPCB for LED Lighting

2016 High Quality Three Dimensional MCPCB for LED Lighting

FOB Price: Get Latest Price
Min. Order: 5 Square Meters
Port: Shanghai, China
Production Capacity: 3000.00sqms/Month
Payment Terms: L/C, T/T

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Basic Info
  • Model NO.: New Product-11
  • Material: Aluminium
  • Processing Technology: Electrolytic Foil
  • Insulation Materials: Organic Resin
  • Board Thickness: 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm, 2.2mm
  • Sample Date: 3-5days
  • Transport Package: Vacuum Packing
  • Origin: China
  • Structure: Single-Sided Rigid PCB
  • Flame Retardant Properties: V0
  • Production Process: Subtractive Process
  • Surface Technique: Hal, HASL, OSP
  • Thermal Conductivity: 1.0W/M.K, 1.5W/M.K, 2.0W/M.K, 3.0W/M.K, 4.0W/M.K
  • Trademark: DJ
  • Specification: SGS UL ISO
  • HS Code: 85340090
Product Description
Material: Aluminium
Layer Coverage: 1Layer
Thickness: 1.6mm
Surface Technique: HAL, HASL, OSP
Line Width/Space: 0.2mm
Thermal Conductivity: 1.0W/mk, 2.0W/mk, 3.0W/m. K
Copper: 1oz. 2oz. 3oz
Solder Mask Color: White, black.

Features:

1.3D foldable aluminum base LED board make the light 360 angles illuminate!

2. Mainly used in automobile fields, foldable LED light can meet car lamp all requirements, which can be folded to any shape to make the head lamp more beautiful, meanwhile aluminum base LED light has very good heat dissipation function, which make the lamp life more longer.

3.3D LED light make the energy fully used, it is energy saving and environmentally friendly.
 Test itemTechnology requestUnitTest result
1Peel StrengthA≥ 1.0N/mm1.05
After thermal stress (260 ordm;C )≥ 1.0N/mm1.05
2Blister test AfterThermal stress (288 ordm;C, 2min)288ordm;C  2 min
No delaminating
/OK
3Themal Resistance≤ 2.0ordm;C /W0.65
4Flammability(A)FV-O/FV-O
5Surface ResistivityA≥ 1 × 10 5M Ω5.0 × 10 7
Constant humidity treatment
(90%,3 5 ordm;C ,96h)
≥ 1 × 10 5M Ω4.5 × 10 6
6
7
Volume ResistivityA≥ 1 × 10 6M Ω@ m1.0 × 10 8
Constant humidity treatment
(90%,3 5 ordm;C ,96h)
≥ 1 × 10 6M Ω@ m1.9 × 10 7
8Dielectric Breakdown (DC )≥ 25Kv/mm31
9Dielectric constant (1MHz)
(40 ordm;C, 93% , 96h)
≤ 4.4/4.2
10Dielectric dissipation factor (1MHz )
(40ordm;C ,93%,96h)
≤ 0.03/0.029
 Accelerated aging experiment
(125 ordm;C ,2000h)
 The laminate bace should no wrinkles,no crack,no delaminating or no pine/OK
11High low temperature impact test
(-50 ordm;C, 15min, 80ordm;C , 15minTOTAL   DO 15 ~ 20 Circulation) 
Peel Strength/N/mm1.39 ~ 1.64
Surface Resistivity/M Ω1.9 × 10 8 ~6.4 × 10 8
 
 
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