Gold Member Since 2008
Audited Supplier
Zhejiang Zapon Electronic Technology Co., Ltd.

MCPCB, Aluminum Base PCB, Metal Core PCB manufacturer / supplier in China, offering LED Aluminum 2.0mm 1oz 1.0W/M. L PCB Board, Vehicle Light Round LED PCB 94V0 Aluminum PCB, High Quality Aluminium PCB Circuit, Aluminum LED Board, Straight LED Aluminum PCB and so on.

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Supplier Homepage Product Aluminum PCB LED Aluminum 2.0mm 1oz 1.0W/M. L PCB Board

LED Aluminum 2.0mm 1oz 1.0W/M. L PCB Board

FOB Price: US $65-90 / Square Meter
Min. Order: 5 Square Meters
Min. Order FOB Price
5 Square Meters US $65-90/ Square Meter
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Production Capacity: 5000sqm/Month
Transport Package: Vacuum Packing
Payment Terms: L/C, T/T

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Basic Info
  • Model NO.: Aluminum pcb-13
  • Material: Aluminium
  • Production Process: Subtractive Process
  • Board Thickness: 0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.2mm
  • Ccl Brand: Jh,Ccaf.etc
  • Trademark: ZAPON
  • Origin: China
  • Structure: Metal Base Rigid PCB
  • Flame Retardant Properties: V0
  • Base Material: Aluminum
  • Thermal Conductivity: 1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K
  • Sample Date: 3-5days
  • Specification: UL ISO TS16949 IPC
  • HS Code: 85340090
Product Description
Aluminum base copper-clad laminate have excellent flame retardant, high mechanical strength, dimensional stability etc. Especially it has very good heat sink, electromagnetic shielding and solder float.

It's widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, sound box, power supply module and acoustics shielding system etc.

Note: We specially produces Metal Base Copper-Clad Laminates, and our products have been compiled series with all complete specifications.
The tapy and specification of Aluminum based Laminates CCAF-01, CCAF-04-A, CCAF-05etc. And 0.8mm, 1.0mm, 1.5mm, 2.0mm, etc.
Thickness of the copper: 18um, 35um, 70um, 105um.
Base size: 500mm × , 600mm (20"× , 24"); 600mm × , 1060mm (24"× , 42")

CCAF-04-A Aluminum-base copper-clad laminate
The test base: CCAF-04 the high heat dissipation Aluminum-base copper-clad laminate
Thickness of the copper: 35um
Thickness of the diclectric: 80um(matrial of the high heat dissipation)
Thickness of the aluminum-base: 1.5mm

The result of the test:
Item
 
Test item
 
Technology request
 
Unit
 
Test result
 
1
 
Peel Strength
 
A
 
≥ 1.0
 
N/mm
 
1.05
 
After thermal stress (260 ordm;C )
 
≥ 1.0
 
N/mm
 
1.05
 
2
 
Blister test AfterThermal stress (288 ordm;C, 2min)
 
288ordm;C  2 min
No delaminating
 
/
 
OK
 
3
 
Themal Resistance
 
≤ 2.0
 
ordm;C /W
 
0.65
 
4
 
Flammability(A)
 
FV-O
 
/
 
FV-O
 
5
 
Surface Resistivity
 
A
 
≥ 1 × 10 5
 
M Ω
 
5.0 × 10 7
 
Constant humidity treatment
(90%,3 5 ordm;C ,96h)
 
≥ 1 × 10 5
 
M Ω
 
4.5 × 10 6
 
6
7
 
Volume Resistivity
 
A
 
≥ 1 × 10 6
 
M Ω@ m
 
1.0 × 10 8
 
Constant humidity treatment
(90%,3 5 ordm;C ,96h)
 
≥ 1 × 10 6
 
M Ω@ m
 
1.9 × 10 7
 
8
 
Dielectric Breakdown (DC )
 
≥ 25
 
Kv/mm
 
31
 
9
 
Dielectric constant (1MHz)
(40 ordm;C, 93% , 96h)
 
≤ 4.4
 
/
 
4.2
 
10
 
Dielectric dissipation factor (1MHz )
(40ordm;C ,93%,96h)
 
≤ 0.03
 
/
 
0.029
 

 
Accelerated aging experiment
(125 ordm;C ,2000h)
 

 
The laminate bace should no wrinkles,no crack,no delaminating or no pine
 
/
 
OK
 
11
 
High low temperature impact test
(-50 ordm;C, 15min, 80ordm;C , 15minTOTAL   DO 15 ~ 20 Circulation) 
Peel Strength
 
/
 
N/mm
 
1.39 ~ 1.64
 
Surface Resistivity
 
/
 
M Ω
 
1.9 × 10 8 ~6.4 × 10 8
 
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Ms. Jenny Jia
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